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Based on the nameplate you provided and the technical data for the
S3088 SPI
(Solder Paste Inspection) variant
here are the key specifications for your machine
PCs replaced in 2024 to new ones
Core Inspection Capabilities
The S3088 SPI is a specialized high-performance system designed to detect printing defects immediately after the stencil printer
Inspection Scope
Analyzes solder paste deposits for
volume
height
form
area
displacement (X/Y offset)
and smearing
Component Compatibility
Capable of inspecting demanding assemblies with CSPs
micro BGAs
and pad sizes down to
01005
3D Technology
Uses a
fringe projection process
for precise 3D height and volume measurement
Inspection Speed
Up to
80 cm²/s
(depending on resolution settings)
Technical Specifications (from your Nameplate & Records)
FeatureDetails
TypeS3088 SPI (Serial No. 102688)Year of Manufacture09/2014ResolutionUp to 15 µm/pixel (lateral)Z-ResolutionTypically 0.1 µm or 0.5 µm for height measurementMax PCB Size$508\text{ mm} \times 508\text{ mm}$ (standard)Positioning UnitSynchronous linear motors for high-speed accuracyPower Consumption1.2 kW (at 230/400V)Weight700 kg
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https://www.ucymachines.com/
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sales@ucymachines.com